

- Proven stability & exceptional lifetime with average power up to 60 W
- Maximum pulse energy of up to 200 µJ
- < 270 fs – 20 ps pulse tunability
- Superior beam quality thanks to all-fiber optical design
- Advanced Pulse-on-Demand and Custom Envelope Burst with bursts up to 80 pulses
- Immediate reaction to external trigger signal providing 100-fold accuracy improvement of the laser system
- 5-year warranty on oscillator and 2-year on the complete laser as a standard
The Jasper X1 is a high-performance femtosecond laser system designed for maximum flexibility and precision in demanding applications. It features extended burst lengths with flexible envelope adjustment (Custom Envelope Burst – CEB), along with tunable pulse durations up to 20 ps. This allows for precise process optimization tailored to a wide range of materials and applications.
With Advanced Pulse-on-Demand (APoD) and nanosecond-level jitter, Jasper X1 delivers exceptional pulse timing precision – ideal for enhancing edge definition, corner processing, and maximized duty cycles. Built as a robust, all-fiber, SESAM-free system, Jasper X1 ensures consistent performance, long-term stability, and true maintenance-free 24/7 operation.
Model | JX30-100 | JX30-200 | JX30-200P | JX60-200 | JX60-200P |
Central Wavelength | 1030 ± 5 nm | ||||
Average Power | 30 W (1) | 60 W | |||
Max. Pulse Energy | 100 µJ | 200 µJ | 200 µJ | ||
Nominal Pulse Repetition Rate (PRR) | 300 kHz | 150 kHz | 300 kHz | ||
Pulse Width | < 270 fs (2) | ||||
Tuning Range | < 270 fs – 8 ps | < 270 fs – 20 ps | |||
Pulse Repetition Rate (PRR) | Single-Shot to 20 MHz (3) | ||||
Pulse-on-Demand Max. PRR / Jitter |
Standard (based on pulse picker) |
Advanced (4) 1 MHz / < 50 ns |
Standard (based on pulse picker) |
Advanced (4) 1 MHz / < 50 ns |
|
Max. Burst Energy | 100 µJ (6) | 300 µJ (6) | 400 µJ (6) | ||
No. of Pulses in MHz Burst Mode | 2 – 80 | 2 – 80 | 2 – 12 | 2 – 80 | 2 – 12 |
Custom Envelope Burst (5) | Optional | Included | – | Included | – |
Beam Quality, M2 | < 1.2 (1.1 typical) | ||||
Beam Circularity | > 87% | ||||
Beam Divergence | < 1 mrad | ||||
Beam Diameter | 2.5 ± 0.5 mm (7) | ||||
Polarization, PER | Vertical, PER > 28 dB | ||||
Beam Pointing Stability | < 20 µrad/°C | ||||
Long Term Power Stability – 100 h | < 0.5% (8) | ||||
Pulse-to-Pulse Energy Stability – 24 h | < 1% (8) | ||||
Triggering | External / Internal | ||||
Pulse Control | Internal / External analog power modulation, Pulse picker, Burst mode, Custom Envelope Burst (CEB) | ||||
Options | Harmonic Module – 515 nm, 343 nm, 257 nm (automatic selection). Automated Mechanical Shutter | ||||
Cooling | Water | ||||
Control Interface | GUI (USB) / SCPI (RS232) / TTL (BNC) / Analog (BNC) | ||||
Laser Head Dimensions (L x W x H) | 1096 x 446 x 100 mm | ||||
Laser Head Weight | 50 kg | ||||
Power Supply Unit Size (L x W x H) | 3U 19” rack unit: 376 x 485 x 133 mm | ||||
Power Supply Unit Weight | 13 kg | ||||
Laser Head Mounting Options | Horizontal / Vertical | ||||
Operation Ambient Temperature | 15 – 30°C | ||||
Relative Humidity | 10 – 80% (non-condensing) | ||||
Power Consumption | < 620 W | ||||
Umbilical | 3 m, Detachable (more upon request) | ||||
Electrical | 100 – 240 V AC, Single Phase 50 – 60 Hz |
All specifications are subject to change without prior notice due to continuous improvements.
1. As a standard > 28 W will be delivered. > 30 W will be delivered upon request.
2. < 240 fs typical.
3. Maximum pulse repetition rate: 20.0 ± 0.5 MHz. Pulse picking up to 2 MHz. In Advanced Pulse-on-Demand version, pulses can be triggered externally up to 1.0 MHz in Stabilized Energy Mode.
4. PRR limit: 1000 ± 60 kHz. Enables constant pulse energy (Stabilized Energy Mode) at fluctuating PRR up to 1.0 MHz (enhanced corner processing and increased pulse positioning accuracy on the material). Constant pulse pitch in micromachining systems providing positioning synchronized output (PSO).
5. Setting arbitrary burst envelope and adjusting amplitude of individual pulse within a burst.
6. Available in High Energy Burst mode (HEB) with PRR reduced below nominal PRR. HEB is available in JX30-100 vartiant upon request.
7. 1/e2, measured at 1 m.
8. NRMSD under stable environmental conditions.
If you require automatic wavelength selection, discover Harmonic Module.
Typical beam profile
Pulse energy vs repetition rate
Laser power vs repetition rate
Typical power stability
Years of stable operation
Typical temporal profile
Typical energy stability
Jasper X1 is the right choice whenever there is a need for high power and high pulse energy while maintaining a very short pulse duration. Some applications include:
- Microelectronics – via drilling in glass, silicon, ceramic and organic substrates, panel cutting, dicing, glass cleaving, marking, repair, SLE, in-volume glass writing
- Micromachining – precision drilling, cutting, trimming
- Medical device manufacturing – stents, microfilters, microfluidics
- Surface engineering: activation before plating/bonding/dispensing, patterning molds, functionalisation, wettability control
- Material compatibility: semiconductors, metals, ceramics, glass, hard materials, crystalline materials, polymers